China’s Ministry of Commerce and Ministry of Science and Technology have proposed revising the country’s catalog of technologies prohibited and restricted from export to include 12 solar photovoltaic manufacturing-related technologies.

The proposed restrictions cover technologies used in polysilicon manufacturing, silicon wafer manufacturing, and solar cell manufacturing. The scope also includes critical and core equipment incorporating these technologies.

Stakeholders have time until November 15, 2026, to submit their feedback.

The proposed prohibitions also cover technologies for manufacturing silicon wafers 70 micrometers thick or less. The restrictions extend to associated equipment manufacturing technologies, including program codes, underlying algorithm models, and equipment drawings.

For solar cell manufacturing, China has proposed prohibiting the export of edge passivation technologies for crystalline silicon cells using wafers measuring 182 mm to 230 mm per side and having a thickness of 140 micrometers or less.

The proposed export ban also covers perovskite-silicon tandem solar cell manufacturing technologies capable of achieving conversion efficiencies of at least 30% using wafers measuring 182 mm or larger.

For TOPCon cells, the restrictions include low-pressure chemical vapor deposition (LPCVD) and plasma-enhanced chemical vapor deposition (PECVD) technologies with production capacities of at least 6,000 G12-equivalent full wafers per hour. Atomic layer deposition technologies with capacities of at least 12,000 G12-equivalent full wafers per hour and high-temperature boron diffusion technologies with capacities of at least 4,500 G12-equivalent full wafers per hour are also covered.

The restrictions also extend to TOPCon copper electroplated electrode manufacturing technologies for wafers measuring 182 mm to 230 mm per side and having thicknesses of 140 micrometers or less.

For XBC cells, the restrictions cover electroplating and chemical coating technologies applicable to wafers measuring 182 mm to 230 mm per side and having thicknesses of 140 micrometers or less.

For HJT cells, the restrictions cover transparent conductive film deposition technologies with indium content of 50% or less or production capacities of at least 14,000 G12 half-wafers per hour.

The government has also introduced temporary pre-export registration requirements for the technologies proposed to be added to the catalog.

The registration requirements took effect on October 16 and will remain applicable until the revised catalog is formally issued and implemented.

Technology exporters must register through the Ministry of Commerce’s unified business platform before exporting the technologies covered by the announcement.

The registration requirements also apply to export transactions that have already commenced but remain incomplete.

Transactions requiring registration include transfers of technology ownership to overseas entities, intellectual property licensing arrangements permitting overseas use of domestic technologies, and changes in the ownership or actual control of domestic technologies to foreign entities.

Exporters must provide details of the technology exporter and recipient, the destination country or region, the technology being exported, its intended application, and the estimated export value.

Last month, China’s Ministry of Industry and Information Technology issued clarifications on mandatory national standards covering solar photovoltaic module safety, labeling, energy efficiency, and energy consumption in silicon manufacturing.

China’s installed solar power capacity reached 1.29 TW at the end of July 2026, up 16.1% year-over-year, according to the latest electricity statistics released by the National Energy Administration.